高速PCB设计中丝印的要求及摆放
1、Display--color/visibility--BoardGeometry勾选中silkscreen top/bottom和soldermasktop/bottom

2、packageGeometry勾选中silkscreen top/bottom和soldermask top/bottom

3、在componets勾选中silkscreen top(bottom) refdes

4、选项→OK ,然后如下图

1、Display--color/visibility--BoardGeometry勾选中silkscreen top/bottom和soldermasktop/bottom
2、packageGeometry勾选中silkscreen top/bottom和soldermask top/bottom
3、在componets勾选中silkscreen top(bottom) refdes
4、选项→OK ,然后如下图